G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Revision:SEMI G87-1108 (Reapproved 0215) - Superseded 0% min and Ethyl benzene

0% min and Ethyl benzene 1% max

due to the migration to large substrate sizes in FPD production

200 mm ウェーハサイズ（要求事項ではないが，過去の課題）についての関連情報をもいくつか含む。

SEMI C23-0708 (technical revision)

1-0226 — Specification for SECS-II Protocol for Control Job Management (CJM)

G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer Revision:SEMI G87-1108 (Reapproved 0215) - Superseded 0% min and Ethyl benzeneThe purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers. This Specification is applicable to plastic tape frames for 300 mm wafers. This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame. This Standard can be used