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there is no distinction between the two types of applications in these Specifications
SEMI E5-0622 (technical revision)
vehicle and carrier state models)
SEMI E12-88 (first published)
that is used in the semiconductor industry
G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer StdPbc-0915 there is no distinction betweenThe purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die bonding process. This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds