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The interface specified in this Standard is designed for a tool with a sealed minienvironment
This Guide is intended to prevent confusion and misunderstanding between manufacturers and users
previously published in 1996
The results of this test can be used for the qualitative ranking of gas delivery components based on the design as it relates to moisture dry-down performance of the system
一般用は3インチ，100 mm，125 mm，150 mmのウェーハを扱う基本ガイドラインである。
3D00200 - SEMI 3D2 - Specification for Glass Carrier Wafers for 3DS-IC Applications Lang-Japanese The interface specified in thisNOTICE: This Document was reapproved with minor editorial changes. This Specification is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure glass carrier wafers to be used in a 3DS IC process. This Specification describes dimensional, thermal, and wafer preparation characteristics for glass starting material that will be used as carrier wafers in a temporary bonded state. This Specification
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