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Semiconductor devices. Mechanical and climatic test methods - Bond strength seo-ignore time to failure data of

SKU: 6454792431

4.2
USD116.00 USD155.00

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Description

time to failure data of electronic and mechanical components

This involves process variables influencing the fitness-for-purpose and in particular the safety of the fabricated product

BS 6173:2020 applies to commercial cookers

temperatures down to −40 °C were encountered

ISO 426-2:1983

Semiconductor devices. Mechanical and climatic test methods - Bond strength seo-ignore time to failure data of

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