G02900 - SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法 Revision:SEMI G29-1296E (Reapproved 0811) - Superseded this Document also addresses the

Name: G02900 - SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法 Revision:SEMI G29-1296E (Reapproved 0811) - Superseded this Document also addresses the
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Description

this Document also addresses the back side of a patterned wafer

SEMI E68-0997 (Reapproved 1103)

For the purposes of this Guide

2 Therefore

It is described as brick slice code (BSC)

G02900 - SEMI G29 - モールディングコンパウンド中の微量異物検査のための試験方法 Revision:SEMI G29-1296E (Reapproved 0811) - Superseded this Document also addresses theglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org198620029 : Referenced SEMI Standards None.

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