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BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module ZUSFUL and highly wear-resistant

SKU: 62848939007

4.6
USD59.95 USD87.95

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USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 20 - Sep 25

Description

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BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module ZUSFUL and highly wear-resistantProduct specifications: Each bottle contains about 25,000 tin solder balls, 0. 3 0. 76mm, including 9 sizes, to meet your basic welding needs, with good practicability Function: Reballing stencils to connect semiconductor wafers and circuit template machine PCB board, transmit electronic to ultra small tin electronic parts Professional Manufacturing: BGA bead add trace elements, improve the oxidation resistance and reliability of the tin ball, to

Exchange/Return Notes
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  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
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