BGA Reballing Stencils, Universal BGA Stencils with Fast Tin Implantation, Stainless Steel Reballing Stencils Templates 0.3 0.35 0.4 0.5 for Cellphones LitKiwi User-Friendly Features: With the integrated

User-Friendly Features: With the integrated test/silent button

ARTISAN-GRADE CRAFTSMANSHIP

and various other critical components

enhancing safety and visibility during tracing

as well as residential spaces like garages

BGA Reballing Stencils, Universal BGA Stencils with Fast Tin Implantation, Stainless Steel Reballing Stencils Templates 0.3 0.35 0.4 0.5 for Cellphones LitKiwi User-Friendly Features: With the integratedHIGH PERFORMANCE: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature. FOUR PITCHES: Universal BGA reballing stencils have three types of holes with 0. 3 0. 35 0. 4 0. 5 pitch, four kinds of spacing and multiple sizes. WIDE APPLICATIONS: Universal BGA reballing stencils are versatile and suitable for the common IC used in cell phones today, which can meet your various